The High-Speed Wafer Feeder (HSWF) is the world’s fastest rapid-exchange multi-die feeder. Combined with Universal’s FuzionSC™ Platform, it is the ultimate multi-die solution for heterogeneous integration.
Consumer, Automotive and IoT devices are getting smaller and thinner, 2.5D and SiP multi-die packages are becoming more complex, InFO and Panel Fan-Out are driving large-format batch processing, and volume demands are rising. These new challenges demand a comprehensive solution that breaks traditional boundaries for efficient multi-die assembly.
The High-Speed Wafer Feeder (HSWF) meets these challenges head-on, delivering value with the precision, performance and flexibility to handle today’s most advanced applications, while also enabling you for those to come.
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